Determination of copper concentration in ruthenium electroplating baths
Copper analysis allows the quantification of Cu2+ concentration in ruthenium electroplating baths. Copper can contaminate ruthenium baths causing issues of aesthetic and functional defects in finished products (e.g. pitting, flaking, pitting corrosion). Monitoring the concentration of copper in ruthenium baths is essential as part of the quality control of galvanic processes to ensure their efficiency and meet the high quality standards required by the market.
Method
Test principle
Copper content is determined by its reaction with a chromogen that develops a coloration, the optical intensity of which is proportional to the concentration of Cu in the analyzed sample.
Calibration curve
The calibration curve was obtained by correlating the CDR method with the reference method.
Measuring range
| Analyses | Measuring range | Resolution | Repeatability |
|---|
Reagent test Kits
The chemical analysis instrument for electroplating baths
CDR GalvanLab®
- Complete analysis panel, supplied already configured
- Up to 16 determinations simultaneously
- Possibility of carrying out analyses of the same sample
- Integrated printer
- Full connections (LAN - USB - Bluetooth barcode/QR code reader)
